From March 25-27, 2026, productronica China 2026 was held at the Shanghai New International Expo Centre. CTW showcased its MEKA brand at booth E3.3300, presenting a range of inspection and line-integration equipment for SMT/DIP processes under the theme "Inspection and Line Solutions for Smart Manufacturing Upgrade," highlighting the company's latest achievements in full-process PCBA quality inspection and automation.
Highlight 1: Pan-Semiconductor 3D Inspection & FAVI-Omni All-Round AI Vision Inspection
- Pan-Semiconductor 3D Inspection System: High-precision inspection for semiconductor packaging processes, designed for complex package structures with measurement accuracy controlled to micron level, meeting semiconductor-grade precision requirements
- FAVI-Omni AI Vision Inspection System: Equipped with a proprietary six-axis robotic arm for all-angle, all-round inspection — the industry's first truly standardized all-round inspection solution
Highlight 2: Smart DIP Line, Live Machine Demonstration
This exhibition featured a portable pre-wave AOI, the CM-530 flexible standard inserter, and the MEKA-AUB top/bottom AOI, covering a complete solution across pre-wave inspection, automatic insertion, and post-wave inspection, all demonstrated live. The MEKA-B2 portable pre-wave AOI uses a floor-standing design that requires no production line modification for rapid deployment, greatly saving changeover time. It supports AI auto-programming and automatic standard component recognition, handles mixed-board inspection up to 1000×266mm, and offers a choice of 20MP, 25MP, or 65MP cameras to meet different precision requirements. Many customers evaluating or advancing DIP process automation explored the full line configuration in detail at the booth.
Highlight 3: SMT Line Solution, Live Demonstration with Hanwha
The booth featured a live-running SMT 3D SPI + high-speed mounter + SMT 3D AOI line solution. Partnering with Hanwha, CTW connected data across printing, placement, and reflow stages to form a closed-loop APC (Advanced Process Control) system, enabling real-time data collection and analysis, automatic process parameter optimization, continuous yield improvement, and full digital traceability.
Closing Remarks
Thank you to every new and returning customer and partner who visited booth E3.3300. Over three days, CTW shared its products, discussed process challenges, and gathered valuable feedback from visitors. These exchanges will continue to drive CTW's technological innovation in inspection and line solutions, helping the electronics manufacturing industry advance toward a smarter future.