Core Technologies
Integrating AI Intelligence, 3D Vision and Precision Control to Build a Full-Process 'Assembly + Inspection' Core Technology System for PCBA
3D Vision Inspection
A fully self-developed 3D imaging system covering single to quad projection with flexible top/bottom illumination combinations. Based on Moiré fringe projection for 3D reconstruction, achieving 3.5μm pixel precision, height measurement range of 100-3000μm with overall accuracy within ±1μm. Supports MiniLED ultra-fine solder paste inspection (minimum diameter 50μm) with depth imaging optimization for highly reflective components.
- Self-developed 3D imaging: single to quad projection full-series coverage
- Moiré fringe 3D reconstruction with 3.5μm pixel precision
- Height measurement 100-3000μm with ±1μm accuracy
- MiniLED solder paste down to 50μm, reflective component optimization
AI Intelligent Detection
A deep learning-based AI visual inspection platform covering thousands of SMT components (capacitors, resistors, ICs, LEDs, USB, etc.) and hundreds of DIP components (connectors, transformers, transistors, inductors, etc.) for automatic programming. Supports AI-OCR character recognition, Gerber-free AI programming (one-click 3D point cloud integration), and AI foreign object detection (solder balls, scratches, dirt). Combining traditional algorithms, 3D imaging, and AI for multi-method inspection with escape rate ≤0.1%.
- SMT AI auto-programming for thousands of surface-mount components
- DIP AI auto-programming covering hundreds of through-hole components
- AI-OCR, Gerber-free AI programming, AI foreign object detection
- Traditional + 3D + AI multi-method detection, escape rate ≤0.1%
Self-Developed Core Hardware
All MEKA inspection equipment features self-developed core hardware. The head control driver card uses a high-sensitivity, high-efficiency dual magnetic circuit design, paired with 5-segment SMD LED light source and 3000-level precise light control for stable, efficient image acquisition. The exclusive patented precision light source system ensures consistent parameters across all devices, allowing inspection programs to be directly reused between machines — significantly reducing production switchover costs. Modular light source design enables easy maintenance, while the highly optimized hardware-software architecture ensures long-term operational stability and reliability.
- Self-developed head control driver with dual magnetic circuit design
- 5-segment SMD LED light source + 3000-level precise light control
- Patented light source system enabling cross-device program reuse
- Modular light source design for easy maintenance and long-term reliability
Unified Software Platform
All MEKA inspection equipment adopts a family-oriented software design — 3D AOI, 2D AOI, and 3D SPI share unified operating logic for quick cross-training. Complemented by SPI Programming System, Statistical Process Control (SPC) for real-time quality monitoring, and Intelligent Rework Station for defect repair assistance. Insertion machines also provide full-featured modular software supporting offline programming, mixed-line production, bad board identification, MES integration, and multi-language operation.
- Family software: 3D AOI / 2D AOI / 3D SPI unified operating logic
- SPC statistical process control for real-time quality trend monitoring
- SPI Programming System + Intelligent Rework Station toolset
- Inserter modular software: offline programming, MES, multi-language
Precision Motion Control
Insertion machines integrate advanced design principles and precision technology from Germany, Japan and Korea. The whole machine uses a cast-iron frame with long-term aging treatment to eliminate internal stress, ensuring long-term stability. The control system features integrated, modular, plug-in architecture for easy maintenance. Main wiring harness uses Korean-imported 0.5mm cables to reduce failure rates. Combined with 4-axis (X/Y/Z/U) precision drive, achieving ±0.025mm repeat positioning accuracy, ±0.05mm insertion accuracy, and process capability index Cpk ≥1.33.
- Cast-iron frame with aging treatment to eliminate internal stress
- 4-axis precision drive with ±0.025mm repeat positioning accuracy
- Korean-imported wiring, modular plug-in control system
- Process capability index Cpk ≥1.33 for consistent quality
High-Speed Insertion
The CAM High-Speed series (CAM-15/16/18/19) is designed for high-throughput scenarios. The flagship CAM-18 achieves 7,200 CPH with 4 gripper nozzles, inserting each component in just 0.5 seconds. The Multi-Functional series (CAM-20/20M) features up to 8 gripper nozzles and 20 feeder stations with insertion coverage of 450×550mm for complex multi-variety production. All models come standard with automatic lead detection, board hole auto-positioning, data statistics, and insertion pressure feedback.
- CAM-18 flagship: 7,200 CPH at 0.5s per component
- CAM-20 multi-functional: 8 nozzles + 20 stations, 450×550mm coverage
- Standard: lead detection, auto-positioning, pressure feedback
- Proven across power adapters, appliances, industrial, automotive
Intelligent Feeding System
Self-developed bulk, tray, tube, and tape feeders covering all packaging types of odd-form components. Bulk feeder handles components up to 65×35×25mm at 0.5s with built-in lead trimming and forming; tray feeder supports dual-tray structure for components up to 60×40×40mm; tube feeder handles 40×25×30mm components (relays, MOSFETs, etc.); tape feeder handles Φ16×25mm components (resistors, capacitors, etc.).
- Bulk feeder: 0.5s speed, built-in trimming/forming for varistors, switches
- Tray feeder: dual-tray structure for transformers, encoders, large components
- Tube feeder: for relays, MOSFETs, opto-chips and tube-packaged components
- Tape feeder: for resistors, varistors, electrolytic capacitors in tape packaging
Flexible Manufacturing
The new CM-530 Flexible Standard Inserter is designed for smart manufacturing with bus architecture for simplified, maintainable operation. MARK-point dynamic calibration ensures precise positioning, with cross-machine feeder and flying-lead interchangeability and 2.0mm-pitch flexible feeder base for rapid changeover. Equipped with full-featured modular software (offline programming, mixed-line production, bad board ID, multi-language support) enabling multi-variety small-batch flexible production.
- Bus architecture: simplified, maintainable modular design
- MARK-point dynamic calibration, cross-machine feeder interchange
- 2.0mm-pitch flexible feeder base for rapid line changeover
- Full modular software with offline programming and mixed-line support
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