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Hanwha HM520 H Mini LED Ultra High-Speed Mounter
Ultra high-speed mounter optimized for Mini LED applications with 65,000 CPH (Wafer) and 78,000 CPH (Chip) placement speed, achieving ±20μm precision - the professional equipment for Mini LED display and backlight production.
Key Specs
Placement Speed65,000 CPH (Wafer) / 78,000 CPH (Chip)
Spindle Configuration20 Spindles × 2 Gantry (Rotary Type)
Placement Accuracy±20μm @ Cpk ≥ 1.0 (Wafer) / ±25μm (Chip)
Component Range0201 ~ □6mm
PCB Size (Single Lane)Min L50×W50, Max L510×W580 (Optional L750×W580)
PCB Size (Dual Lane)Max L510×W310 (Optional L750×W310)
Feeder Capacity80 ea (8mm Docking Cart)
Vision SystemFixed High-Definition Camera
See full specifications below
Applications
Mini LED display panel production
Mini LED backlight module manufacturing
Micro LED chip placement
High-precision wafer-level packaging
Next-generation display technology mass production
Detailed Description
Overview
The Hanwha HM520 H is an ultra high-speed mounter optimized for Mini LED applications. Deeply optimized for Mini LED's micro dimensions and high precision requirements, it achieves 65,000 CPH for wafer placement and 78,000 CPH for chip placement with an outstanding ±20μm accuracy - the professional solution for Mini LED display panel and backlight module production.
Key Advantages
Mini LED Professional Optimization
- Designed specifically for Mini LED chip size and precision requirements
- ±20μm ultra-high precision meets Mini LED's stringent placement demands
- Supports direct wafer placement to simplify process flow
Dual-Mode High-Speed Placement
- Wafer mode: 65,000 CPH for direct wafer pick-and-place
- Chip mode: 78,000 CPH for standard component high-speed placement
- Flexible mode switching adapts to different production needs
890mm Modular Design
- Shares modular platform with HM520 series
- Can be flexibly combined with HS, MF, and other modules
- Compact design delivers highest productivity per unit area
Advanced Vision System
- High-definition fixed camera for fast, precise micro component recognition
- Automatic placement quality inspection prevents defects
- Comprehensive LED polarity detection
Technical Specifications
| Parameter | Specification |
|---|---|
| Placement Speed (Wafer) | 65,000 CPH |
| Placement Speed (Chip) | 78,000 CPH |
| Spindle Configuration | 20 Spindles × 2 Gantry (Rotary Type) |
| Placement Accuracy (Wafer) | ±20μm @ Cpk ≥ 1.0 |
| Placement Accuracy (Chip) | ±25μm @ Cpk ≥ 1.0 |
| Component Range | 0201 ~ □6mm |
| PCB Size (Single Lane) | L50×W50 ~ L510×W580 (Optional L750×W580) |
| PCB Size (Dual Lane) | L510×W310 (Optional L750×W310) |
| Feeder Capacity | 80 ea (8mm Docking Cart) |
| Body Length | 890mm |