FAVI Line
FAVI-Cube Six-Sided Visual Final Inspection
Industry-first single four-axis robot solution integrating loading/unloading, inspection, and NG sorting. Equipped with 25MP camera (65MP optional), DLP structured light projection, minimum 5μm accuracy, 2s/pcs cycle (1,800 pcs/h), escape rate ≤0.1%, overkill ≤2%, with configurable side inspection prism.
Key Specs
Resolution25MP (65MP optional)
Detection Accuracy (25MP)5μm / 7.5μm / 10μm / 15μm
Detection Accuracy (65MP)5μm / 7μm / 14μm / 10μm
Structured LightDLP, single grating projectable to any area
Side InspectionConfigurable side inspection prism
Cycle Time2s/pcs
Throughput1,800 pcs/h
Escape Rate≤0.1%
See full specifications below
Applications
Six-sided electronic component visual inspection
Post-packaging IC chip final inspection
Connector appearance quality check
Precision part surface defect detection
Semiconductor packaging visual inspection
Detailed Description
Overview
The FAVI-Cube is CTW's proprietary six-sided visual final inspection system, featuring an industry-first single four-axis robot solution that integrates loading/unloading, six-sided inspection, and NG sorting into one compact unit.
Key Advantages
Industry-First Single Robot Solution
- Single four-axis robot for loading, inspection, and NG sorting
- Compact footprint, space-efficient
- Easy maintenance, reliable operation
High-Precision Vision System
- 25MP high-resolution camera (65MP optional)
- DLP structured light projection, single grating projectable to any area
- Detection accuracy down to 5μm
- Configurable side inspection prism for extended angle coverage
High Throughput
- 2s/pcs cycle time
- 1,800 pcs/h throughput
- Escape rate ≤0.1%, overkill rate ≤2%
Detection Capabilities
Detectable defect types include:
- Component misalignment / missing / polarity / rotation detection
- Color detection (presence / missing detection)
- Foreign object detection (solder balls, scratches, contamination)
- Pin tilt / height detection
- Solder joint inspection (PCB soldering / reflow)
- Solder paste 2D / COB inspection
- Code / character verification (FineIO, Favi encoding)
- Side inspection (with configurable prism)
Component coverage: 0201 chips, SOP, QFP, BGA, CSP, PA, Flip Chip, Clip Bonding, and more
Specifications
| Parameter | Specification |
|---|---|
| Resolution | 25MP (65MP optional) |
| Accuracy (25MP) | 5μm / 7.5μm / 10μm / 15μm |
| Accuracy (65MP) | 5μm / 7μm / 14μm / 10μm |
| Structured Light | DLP, single grating to any area |
| Side Inspection | Configurable prism |
| Cycle Time | 2s/pcs |
| Throughput | 1,800 pcs/h |
| Escape Rate | ≤0.1% |
| Overkill Rate | ≤2% |
| Dimensions | L1550 × W1200 × H2000mm |
| Weight | 1,600KG |