SMT Line
MEKA-M3 3D Automatic Optical Inspection (3D AOI)
M-Series 3D AOI with modular light source design, self-developed optimized head control board, and stable software architecture. Self-developed 3D solving algorithm offers high efficiency, precision, and stability. Available in M3/M3 Pro/M3 Pro Max/M3 Ultra with four-directional Moiré projection.
Key Specs
ModelsMEKA-M3 / M3 Pro / M3 Pro Max / M3 Ultra
Camera12MP / 19MP / 21MP / 21MP
Pixel Size3.5um~15um
Inspection Speed0.49s / 0.55s / 0.55s / 0.55s per FOV
Max PCB (Single-lane)50×50 ~ 510×460mm
Max PCB (Double-lane)50×50 ~ 510×580mm (Single Mode) / 50×50 ~ 510×320mm (Dual Mode)
DLPFour-Directional Moiré Pattern Projection
Height Accuracy±3um (Standard) / ±1um (Ultra)
See full specifications below
Applications
Post-reflow SMT 3D inspection
Component height/coplanarity inspection
Solder joint 3D morphology analysis
Component misalignment/missing/polarity error detection
Complex BGA/QFP package inspection
Detailed Description
Overview
The MEKA-M3 is CTW's self-developed 3D Automatic Optical Inspection (3D AOI) system in the M-Series. Featuring modular light source design, self-developed optimized head control board, stable and reliable software architecture, with four-directional Moiré projection 3D inspection technology.
Key Advantages
Self-developed 3D Algorithm
- High efficiency, precision, and stability
- Optimizable for specific usage scenarios
- Four-directional Moiré projection technology
Modular Light Source Design
- Self-developed optimized head control board
- Stable and reliable software architecture
- 5-Stage high-precision color lighting system
High-Precision 3D Inspection
- Height accuracy ±3um (Standard) / ±1um (Ultra)
- Up to 21MP camera resolution
- Pixel size down to 3.5um
Multiple Models
| Model | Camera | Speed | Height Accuracy |
|---|---|---|---|
| MEKA-M3 | 12MP | 0.49s/FOV | ±3um |
| MEKA-M3 Pro | 19MP | 0.55s/FOV | ±3um |
| MEKA-M3 Pro Max | 21MP | 0.55s/FOV | ±3um |
| MEKA-M3 Ultra | 21MP | 0.55s/FOV | ±1um |