DIP Line
MEKA-B2 Before-Wave Automatic Optical Inspection (Before-Wave AOI)
B-Series Before-Wave AOI. Cost-effective pre-furnace wide-field AOI solution supporting mixed-board mode with maximum test length up to 1 meter. Camera resolution 20MP/25MP/65MP with adjustable pixel resolution. Planar Light + Four-Side Lateral Light illumination system.
Key Specs
ModelMEKA-B2
Max PCB Size (Online AOI)L400mm×W266mm (75μm, Normal Mode) / L1000mm×W266mm (75μm, Mixed Board Mode)
Camera20MP / 25MP / 65MP
Pixel ResolutionAdjustable
Lighting SystemPlanar Light + Four-Side Lateral Light
PCBA Transfer HeightAdjustable
StandardBuilt-in SPC, Built-in Re-inspection Software, Mixed Board Mode
OptionalBarcode Reader, Repair Station Computer, Offline Programming System, MES Integration, SPC+, AI Programming, AI Re-evaluation
See full specifications below
Applications
Pre-wave soldering component insertion inspection
Through-hole component polarity/missing/offset detection
Mixed-board mode long board inspection (up to 1m)
Pre-soldering through-hole component quality confirmation
Final gate before wave soldering on DIP lines
Detailed Description
Overview
The MEKA-B2 is CTW's self-developed Before-Wave Automatic Optical Inspection (Before-Wave AOI) in the B-Series. A cost-effective pre-furnace wide-field AOI solution supporting mixed-board mode with maximum test length up to 1 meter.
Key Advantages
Wide-Field Cost-Effective Solution
- Pre-furnace wide-field AOI solution
- Mixed-board mode supporting up to 1m test length
- Cost-effective for various line configurations
Flexible Camera Configuration
- 20MP / 25MP / 65MP options
- Adjustable pixel resolution
- Planar Light + Four-Side Lateral Light illumination
AI Smart Programming
- Standard materials support AI programming
- Continuously expanding material library
- Reduces programming threshold and time
Compact & Lightweight
- Weight only ~200KG
- Adjustable depth and height
- Suitable for space-constrained lines