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Hanwha XM520 Ultra High-Speed Mounter

Hanwha flagship ultra high-speed placement machine achieving 100,000 CPH, featuring dual gantry 20-spindle rotary head design, supporting components from 0201 to 150×74mm with ±22μm accuracy - ideal for high-volume, high-flexibility electronics manufacturing.

Key Specs

Placement Speed100,000 CPH (Optimum)
Spindle Configuration10 Spindles × 2 Gantry (Rotary Type)
Placement Accuracy±22μm @ Cpk ≥ 1.0
Component Range0201 ~ 150×74mm (H15mm)
PCB SizeMax 900×590mm (Single), Optional 1200×590mm
Feeder Capacity120 ea (8mm Standard)
Vision SystemFlying Vision + Stage Vision
Dimensions (L×D×H)1,430×1,740×1,485mm

See full specifications below

Applications

High-speed mobile phone PCB assembly
High-volume automotive electronics production
Server and telecom equipment manufacturing
LED display module placement
High-density interconnect PCB assembly

Detailed Description

Overview

The Hanwha XM520 is Hanwha Precision Machinery's flagship ultra high-speed mounter, achieving an industry-leading placement speed of 100,000 CPH. Featuring advanced dual gantry 10-spindle rotary head design with dual flying and stage vision systems, it delivers high-speed precision placement across the full range from 0201 micro components to 150×74mm large devices.

Key Advantages

Ultimate Speed

  • 100,000 CPH peak placement speed - highest in class
  • Dual gantry independent operation for maximum efficiency
  • Optimized motion control algorithms minimize idle travel time

Ultra-Wide Component Compatibility

  • Supports 0201 (0.6×0.3mm) to 150×74mm full range
  • Maximum component height of 15mm
  • Compatible with all package types: Chip, SOP, QFP, BGA, CSP, etc.

High Precision Placement

  • Industry-leading ±22μm @ Cpk ≥ 1.0 accuracy
  • High-resolution vision system for precise feature recognition
  • Automatic placement offset correction

Smart Manufacturing

  • T-Solution Smart Factory software platform
  • Real-time production data monitoring and analysis
  • Supports unmanned, non-stop, zero-defect production
  • Complete component traceability

Technical Specifications

ParameterSpecification
Placement Speed100,000 CPH (Optimum)
Spindle Configuration10 Spindles × 2 Gantry (Rotary Type)
Placement Accuracy±22μm @ Cpk ≥ 1.0
Component Range0201 ~ 150×74mm (H15mm)
PCB Size (Single)Max 900×590mm (Optional 1200×590mm)
Feeder Capacity120 ea (8mm Standard)
Vision SystemFlying Vision + Stage Vision
Dimensions (L×D×H)1,430×1,740×1,485mm
WeightApprox. 1,800kg
Power3-Phase AC 200/208/220/240/380/415V ±10%